About PostProcess Technologies
PostProcess Technologies is the pioneer of the automated post-printing industry. As the first and only provider of automated and intelligent post-print solutions for additive manufacturing, PostProcess increases the consistency, throughput, and productivity of the third step of 3D printing – post-printing.
Their solutions work with all materials, including plastics and metals, and all 3D printing technologies such as FDM, PolyJet, SLA, DLP, SLS, MJF, DMLS, SLM, and DED.
Their unique, digital approach to the integration of software, hardware, and chemistry technologies delivers a step-change in customers’ additive operations, enabling the delivery of customer-ready 3D printed parts with a rapid return on investment.
Delivering unparalleled consistency, throughput, productivity, PostProcess allows customers to realize the full potential of additive manufacturing.
Support & resin removal systems
PostProcess Technologies cutting-edge solutions automate support and resin removal using patent-pending software and exclusive chemistry technologies. Their proprietary process reliably removes support materials from all 3D printed parts while reducing cycle time and increasing productivity.
Base
- Printing technology: FDM, POLYJET, SLA, DLP, CLIP
- Removal technology: Volume Velocity Dispersion (VVD)
- Envelope: 102 cm x 70 cm x 66 cm
Deci
- Printing technology: FDM, POLYJET, SLA, DLP, CLIP
- Removal technology: Volume Velocity Dispersion (VVD)
- Envelope: 48 cm x 70 cm x 66 cm
Demi 4000
- Printing technology: SLA, DLP, CLIP
- Removal technology: Submersed Vortex Cavitation (SVC)
- Envelope: 89 cm x 89 cm x 63.5 cm
Demi 800
- Printing technology: FDM, POLYJET, SLA, DLP, CLIP
- Removal technology: Submersed Vortex Cavitation (SVC)
- Envelope: 46 cm x 46 cm x 46 cm
Demi 400
- Printing technology: FDM, POLYJET, SLA, DLP, CLIP
- Removal technology: Submersed Vortex Cavitation (SVC)
- Envelope: 35.5 cm x 35.5 cm x 35.5 cm
Demi 200
- Printing technology: FDM, POLYJET, SLA, CLIP
- Removal technology: Submersed Vortex Cavitation (SVC)
- Envelope: 46 cm x 25 cm x 15 cm
Surface finishing systems
Rough unfinished surfaces on 3D printed parts show build lines and the raw nature of the build process. The method of hand finishing is expensive, inconsistent, and does not scale when production runs are more than a few. PostProcess automates today’s manual methods and ensures every printed part meets your specifications, such as desired Roughness Average (Ra) and dimensional consistency.
Rador
- Printing technology: FDM, POLYJET, SLA, CLIP, MJF, SLS
- Removal technology: Suspended Rotational Force (SRF)
- Envelope: 54 cm x 22 cm x 33 cm
Nitor
- Printing technology: FDM, POLYJET, SLA, DLP, CLIP, MJF, SLS, DMLS, SLM, DED
- Removal technology: Suspended Rotational Force (SRF)
- Envelope: 153 cm x 61 cm x 51 cm
Hybrid solutions
Delivering replicable, high-quality uniformity for every part, every time – even with the most complex geometries. PostProcess multi-functioning, patent-pending Hybrid Series machines tackle both support removal and surface finishing in one compact footprint. Developed to address the most complex and rugged of today’s additive manufacturing materials, their Hybrid Series delivers fast cycle times by optimizing energy to meet your desired specifications.
Deci Duo
- Printing technology: SLA, MJF, SLS, DMLS, SLM, DED
- Removal technology: Thermal Atomized Fusillade (TAF)
- Envelope: 38 cm x 38 cm x 38 cm
Chemistry technology
As the pioneer of the automated post-printing industry, PostProcess Technologies’ patent-pending software, hardware, and chemistry solutions work together to provide an unmatched solution for 3D printed parts. Their innovation extends to their proprietary, additive formulated detergents and media that have been developed for high-performance and safe handling.
